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Abstract Most commercial systems for ultraviolet-visible (UV–VIS), Fourier-transform infrared, circular dichroism (CD), and fluorescence spectroscopies are designed for measurement of liquid samples. Moreover, adapters enabling the measurement of solid samples are expensive or unavailable for most commercial instruments. Consequently, there is a significant need for solid sample adapters that enable measurement of both liquid and solid samples with a single system. Here, we report two versions of a solid sample adapter cuvette that can be used in most commercial spectroscopy instruments designed for transmission measurement of liquid samples. One version is designed for techniques that do not require changing the sample orientation, and the other allows easy sample rotation. We successfully fabricated these cuvettes by 3D printing with both fused deposition modeling and stereolithography and demonstrated how they enable us to study the optical properties of macroscopic films of aligned carbon nanotubes by performing UV–VIS and CD spectroscopy measurements with the cuvettes. These 3D printed cuvettes and their implementation will help enable a wide range of experiments at a low cost. 

Neat, densely packed, and highly aligned carbon nanotube fibers (CNTFs) have appealing room-temperature axial thermal conductivity (k) and thermal diffusivity (α) for applications in lightweight heat spreading, flexible thermal connections, and thermoelectric active cooling. Although CNTFs are regularly produced from different input carbon nanotubes (CNTs), prior work has not quantified how the CNT molecular aspect ratio r (i.e., molecular length-to-diameter ratio) influences k and α in well-aligned, packed CNTFs. Here, we perform self-heated steady-state and three-omega thermal measurements at room temperature on CNTF suspended in vacuum. Our results show that k increases from 150 to 380W/mK for viscosity-averaged molecular aspect ratios increasing from r=960 to 5600 and nanotube diameters of ∼2 nm, which we attribute to the effects of thermal resistances between CNT bundles. CNTFs made with varying volume fraction ϕ of constituent high-r and low-r CNT have properties that fall within or below the typical macroscopic rule-of-mixtures bounds. The thermal diffusivity α scales with k, leading to a sample-averaged volumetric heat capacity of 1.5±0.3MJ/m3K. This work's findings that fibers made from longer CNT have larger k and α at room temperature motivate further investigation into thermal transport in solution-spun CNTF. 

Thermoelectric active cooling uses nontraditional thermoelectric materials with high thermal conductivity, high thermoelectric power factor, and relatively low figure of merit (ZT) to transfer large heat flows from a hot object to a cold heat sink. However, prior studies have not considered the influence of external thermal resistances associated with the heat sinks or contacts, making it difficult to design active cooling thermal systems or compare the use of low-ZT and high-ZT materials. Here, we perform a non-dimensionalized analysis of thermoelectric active cooling under forced heat flow boundary conditions, including arbitrary external thermal resistances. We identify the optimal electrical currents to minimize the heat source temperature and find the crossover heat flows at which low-ZT active cooling leads to lower source temperatures than high-ZT and even ZT→+∞ thermoelectric refrigeration. These optimal parameters are insensitive to the thermal resistance between the heat source and thermoelectric materials, but depend strongly on the heat sink thermal resistance. Finally, we map the boundaries where active cooling yields lower source temperatures than thermoelectric refrigeration. For currently considered active cooling materials, active cooling with ZT < 0.1 is advantageous compared to ZT→+∞ refrigeration for dimensionless heat sink thermal conductances larger than 15 and dimensionless source powers between 1 and 100. Thus, our results motivate further investigation of system-level thermoelectric active cooling for applications in electronics thermal management.